Solder Pastes

Heraeus offers a full line of no clean, solvent clean, and water soluble solder pastes for surface mount and semiconductor applications. Sn/Ag, SAC, Sn/Bi, Sn/Sb, and other alloys are available in melting points from 138 °C to 240 °C.

Heraeus offers a full line of no clean, solvent clean, and water soluble solder pastes for surface mount and semiconductor applications. Sn/Pb and Sn/Pb/Ag alloys are available in melting points from 179 °C to 312 °C.

Based on more than 20 years experience in solderpaste manufacturing, Heraeus has developed special bumping solder pastes for various printing applications. The capabilities are ranging from dry film (licensed by FCI) to stencil processes.

SolderPro Series Technology that addresses the challenges of applications requiring perfect solder joints, as well as being mechanically & electrically extremely safe.