Sinter Pastes
|
|
Name / Series
|
|
|
Application technique
|
Dispensing
|
|
|
Stencil printing
|
|
|
Curing conditions and key properties
|
Curing at 80 °C to 150 °C
|
|
|
High adhesion
|
|
|
High temp. Stable
|
|
|
High thermal conductivity1)
|
|
|
Substrates
|
Leadframe
|
|
|
Ceramic
|
|
|
PCB
|
|
|
Flex
|
|
|
|
Notes: +=recommended, ○=possible, 1) 1.3 to 1.6 W/m*K
|
|
