For a wide range of applications, where no electrical conductivity is necessary, Heraeus offers a selection of different glues (NCA = non conductive adhesive) to fulfill the requirements of assembly and semiconductor applications. A temperature range from 80°C to 180°C and curing times from 10 sec. to 90 min. covers a wide range of applications.
Depending on the kind of device and size of bare dies, die attach glues with different flexibility are available. High shear strength and excellent reliability are the advantages of these materials to connect bare dies and different components like lids, optical components to leadframes, flexible substrates, foils, LCP and many other basic substrates.
