Copper Bonding Wires

Copper bonding wires have a high purity Cu matrix and achieve their excellent processing properties by means of defined addition elements. They distinguish themselves by stable mechanical properties and the high reliability of the bonding joint, in particular as regards the reduced formation of intermetallic phases in comparison with the usual Au-Al system.
They are excellent for bonding with the ball / wedge process when using a reducing protective gas atmosphere. Processing is also possible in the wedge / wedge bonding process. Copper bonding wires are, therefore, both technically and economically an alternative to gold wires. A packaging concept tailor-made for Cu wires ensures that even after storage times of up to six months the wires can be readily processed.

Copper Fine Wires (<1.3 mil; <33 µm)

Excellent mechanical and electrical properties allow our ultra-fine copper wires to be used in a variety of high-end,
fine-pitch devices with higher lead counts and smaller pad sizes.

Copper Wires (1.3-4 mil; 33-100 µm)

In addition to the significantly lower cost of copper wires, slower intermetallic growth in copper bonds provides superior reliability in high-power and discrete packages.

Copper Bonding Wires

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