Conductive Adhesive

Heraeus offers a range of conductive adhesives used to attach bare dies and components to the substrate, ceramics, LTCC, leadframes, flex circuits as well as other applications.

The use of conductive adhesives is ideal for processes involving sensitive substrates and components and has advantages in fine pitch or Flip Chip applications. The PC 300x series and other flexible ICAs can be used to assemble dies and components to substrates for high temperature automotive applications such as engine control modules, gear control units and safety equipment.

Other applications for conductive adhesives include die attach on leadframes or flex PCB materials, various electronic and semiconductor components, and assembly of flexible circuits used in cellular phones or other communication devices. The conductive adhesives are optimized for dispensing, jetting, printing or pin transfer applications.

Conductive Adhesive
Name / Series	PC 300x	PC 320x	PC 322x	PC 323x	PC 343x	PC 360x*
Application technique
Screen printing	+	+	+	+	+	+
Stencil printing	+	+	+	+	+
Dispensing	+	+	+	+	+	+
Curing conditions and key properties
Curing at 80 °C to 120 °C	○				○	+
Curing at 120 °C to 180 °C	+	+	+	+	+
Snap cure, e. g. 60 sec / 120 °C						+
Snap cure, e. g. 60 sec / 180 °C		+	+	+
Superior adhesion	+			+
Superior temp. Stability	+¹⁾		+¹⁾	+²⁾
Superior thermal conductivity	+	++	+	+	+
Substrates
Leadframe	○	○	○	+		○
Ceramic	+		+	+	+	○
PCB	+	○	+	○	+	+
Flex	○	+	○	○	+	○
= in developement, +=recommended, ○=possible, ¹⁾ up to 150 °C, ²⁾ up to 180 °C, +=min 5 W/mK, ++=min 6 W/m*K

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